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Zuletzt aktualisiert am Donnerstag, 29. Dezember 2011 um 11:46 Uhr
 
High-precision wafer alignment using image processing systems Drucken
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technical reports - Cameras
Geschrieben von: Ms. Mandy Gebhardt (Head of Marketing Dept. 3D Micromag AG)   
Donnerstag, 10. Juni 2010 um 09:02 Uhr

Within the context of a customer order regarding the rear-side contacting of emitter wrap-through (EWT) solar cells, the Chemnitz-based 3D-Micromac AG successfully positioned the microDRILL-EWT laser micro-processing system, enabling the efficient and, at the same time, high-precision fabrication of micro holes in crystalline solar cells, on the market. In order to attain the high level of precision required in laser processing, the wafers are aligned using camera technology.

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Zuletzt aktualisiert am Donnerstag, 20. Januar 2011 um 16:07 Uhr