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Last Updated on Thursday, 29 December 2011 11:46
 
High-precision wafer alignment using image processing systems Print
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technical reports - Cameras
Written by Ms. Mandy Gebhardt (Head of Marketing Dept. 3D Micromag AG)   
Thursday, 10 June 2010 09:02

Within the context of a customer order regarding the rear-side contacting of emitter wrap-through (EWT) solar cells, the Chemnitz-based 3D-Micromac AG successfully positioned the microDRILL-EWT laser micro-processing system, enabling the efficient and, at the same time, high-precision fabrication of micro holes in crystalline solar cells, on the market. In order to attain the high level of precision required in laser processing, the wafers are aligned using camera technology.

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Last Updated on Thursday, 20 January 2011 16:07