Robotic Vision Systems Gets Order for WS-2500 Bumped Wafer Inspection System

„Order Further Establishes RVSI’s Semiconductor Equipment Group’s Technical Lead in 2-D Defect Detection
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\r\nNASHUA, N.H., Dec. 19 /PRNewswire-FirstCall/ — Robotic Vision Systems, Inc. (RVSI) (RVSI.PK) today said it has received a repeat order for its WS-2500 bumped wafer inspection system from one of Asia’s principal semiconductor manufacturers. The order, the seventh WS-series system to be purchased by this organization, will be used specifically for surface defect inspection on bumped wafers. Depending upon wafer size and other features, the WS-series is priced from $500,000 to more than $1 million per system.“;“\“This order represents an important competitive win for RVSI,\“ said Michael Gray, Vice President – Strategic Development at RVSI’s Semiconductor Equipment Group in Hauppauge, NY. \“This system will be used for surface defect inspection, a two-dimensional requirement that our solution addresses with speed, reliability, and repeatability. In being given the order, we were told that technical solution was head and shoulders above the competition. We have been Plan of Record at this company for the past three years and this will be our seventh system for that one customer.\“
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\r\nBob Michaels, Vice President – Sales for RVSI’s Semiconductor Equipment Group said the order also is firm evidence of the extent to which flip chip technology is coming into commercial use. \“The customer has made clear that an increasing percentage of their output will be flip-chip-based products, which in turn are based on bumped wafer technology. This, in turn, should drive a growing demand for systems to provide the 100% inspection of bumped wafers that the industry requires. We already have a solid leadership position in the bump-height-metrology portion of that market and we are now making serious inroads into the surface defect inspection market as well.\“
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\r\nRather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold \“bumps\“ that are directly deposited on the wafer for electrical connections. RVSI’s WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system’s capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps.
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\r\nAbout RVSI
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\r\nRobotic Vision Systems, Inc. (RVSI) (RVSI.PK) has the most comprehensive line of machine vision systems available today. Headquartered in Nashua, New Hampshire, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and Data Matrix-based unit-level traceability. Using leading-edge technology, RVSI joins vision-enabled process equipment, high- performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies. For more information visit www.rvsi.com or call (800) 669-5234.
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\r\nForward-Looking Statement
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\r\nExcept for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company’s accounting policies and other risk factors detailed in the Company’s annual report on Form 10-K, and other filings with the Securities and Exchange Commission.
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\r\nSource: Robotic Vision Systems, Inc.“;0;164;3;“admin“;““;0;““;0;0;0;0;0

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