Robotic Vision Systems Gets Repeat Order for WS-Series Inspection System

„Semiconductor Equipment Group system will be used for flip-chip substrate inspection
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\r\nNASHUA, N.H., Jan. 7 /PRNewswire-FirstCall/– Robotic Vision Systems, Inc. (RVSI) (OTC: RVSI.PK – News) today said it has received an order for its WS-series flip-chip inspection system from one of the world’s largest semiconductor companies. The order represents the sixth system to be purchased by the customer since December 2001; RVSI’s systems are used for multiple inspection points in the company’s flip-chip assembly process. Depending upon substrate size and other features, WS-series systems are priced from $500,000 to more than $1 million per system.“;“\“This order takes us beyond our original expectations for our work with this particular customer,\“ said Bob Michaels, Vice President – Sales for RVSI’s Semiconductor Equipment Group in Hauppauge, NY. \“Our WS-series was originally selected under a ‚best-of-breed‘ competition for bump height metrology, but this order addresses an area that goes beyond that original selection. Clearly, several things have happened to increase the customer’s requirements. First, flip-chip wafer technology has become a more important part of the customer’s semiconductor production and so there is a basic capacity issue we are addressing.
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\r\n\“Second, and just as important, the customer is utilizing our WS-series systems in a wider range of applications than was originally envisioned,\“ Mr. Michaels said. \“This system will be used for flip-chip substrate inspection and, we believe, is a direct result of our emerging role as the leader in 2-D inspection technology. A system purchased last year is also being utilized as a probe mark inspection tool, a new application and additional inspection point for bumped wafers.\“
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\r\nMichael Gray, Vice President – Strategic Development at the Semiconductor Equipment Group, said RVSI’s leadership in both 3-D bump-height metrology inspection and 2-D surface inspection is resulting in an increasing number of multi-unit sites. \“The sale we are announcing today represents the sixth system for this particular customer. In December we shipped our seventh system to another customer, an Asian semiconductor manufacturer that has standardized on our WS-series. It is not unreasonable to expect that by the end of 2004 we will have three or more customers with up to ten systems each. It is further evidence that we have the right technology built into the right product for this important, growing market.\“
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\r\nRather than traditional wire bonds, the newest generation of integrated circuits utilizes microscopic-sized solder or gold \“bumps\“ that are directly deposited on the wafer for electrical connections. RVSI’s WS-series improves yield management of bumped wafers and flip chip die, providing a method to maximize yields and profitability by inspecting bump parameters at high production rates. The system’s capabilities include inspection of pre-reflow and post-reflow solder bumps and multi-process gold bumps.
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\r\nAbout RVSI
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\r\nRobotic Vision Systems, Inc. (RVSI) (RVSI.PK) has the most comprehensive line of machine vision systems available today. Headquartered in Nashua, New Hampshire, with offices worldwide, RVSI is the world leader in vision-based semiconductor inspection and Data Matrix-based unit-level traceability. Using leading-edge technology, RVSI joins vision-enabled process equipment, high- performance optics, lighting, and advanced hardware and software to assure product quality, identify and track parts, control manufacturing processes, and ultimately enhance profits for companies worldwide. Serving the semiconductor, electronics, aerospace, automotive, pharmaceutical and packaging industries, RVSI holds more than 100 patents in a broad range of technologies. For more information visit www.rvsi.com or call (800) 669-5234.
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\r\nForward Looking Statement
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\r\nExcept for the historical information herein, certain matters discussed in this release include forward-looking statements that may involve a number of risks and uncertainties. Actual results may vary significantly based on a number of factors, including, but not limited to: the historical cyclical nature of the semiconductor industry, risks in products and technology development, market acceptance of new products and continuing product demand, the impact of competitive products and pricing, changing economic conditions, both here and abroad, timely development and release of new products, strategic suppliers and customers, the effect of the company’s accounting policies and other risk factors detailed in the Company’s annual report on Form 10-K, and other filings with the Securities and Exchange Commission.
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\r\nSource: Robotic Vision Systems, Inc.“;0;130;3;“admin“;““;0;““;0;0;0;0;0